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Home > News & Blog > News > 6063 aluminum plate for 5G base stations
In the 5G era, base station heat dissipation is a major technical problem. High temperature causes chip frequency reduction, signal coverage reduction, and operation and maintenance costs to surge. 78% of operators around the world list heat dissipation as the biggest pain point in 5G deployment. More than 60% of electronic equipment failures are directly related to heat dissipation failure. Traditional pure copper solutions are heavy and costly, while 6063 aluminum plates are rewriting the heat dissipation rules of 5G base stations with their golden triangle performance of “lightweight + super thermal conductivity + corrosion resistance”.
1. Exclusive heat dissipation model and state selectionHigh-power chip heat dissipation → 3.0mm T6 aluminum plate + micro-arc oxidation (breakdown voltage > 3000V)
Lightweight mobile devices → 1.5mm T6 aluminum plate + nano-coating (50% lighter than copper)
| Alloy | 6063-T6 (optimal strength/thermal conductivity balance) |
| Thickness | 1.0mm-3.0mm |
| Surface treatment | Anodizing (film thickness 10-15μm) |
| Thermal conductivity | 200W/(m·K) |
| Flatness tolerance | ≤0.15mm/m |
2. Performance advantages| Index | 6063-T6 aluminum plate | Pure copper plate | Carbon steel nickel plate |
| Thermal conductivity | 200W/(m·K) | 398W/(m·K) | 50W/(m·K) |
| Cost/unit thermal conductivity | $0.25 | $1.98 | $0.80 |
| Salt spray resistance time | ＞2000 hours | ＜500 hours | 1200 hours |
| Processability | Stamping/etching/welding | Machining only | Limit welding |
Huawei 5G base station heat sink cost dropped by 40%
Huawei AAU equipment heat dissipation requirements: 200W power consumption, temperature rise <35℃. The original solution used 2mm copper plate, costing $45 per piece and weighing 1.2kg.
✅Solution:
Replaced with 2.5mm 6063-T6 aluminum plate + fin stamping design + black anodizing
Added graphene thermal pad (interface thermal resistance reduced by 60%)
✅Results:
◆ Radiator weight reduced to 0.7kg (42% weight reduction)
◆ Chip temperature dropped from 98℃ to 78℃ (below the safety threshold)
◆ Unit cost is only $27, annual procurement savings exceed $700,000
✅Free thermal simulation:
Upload the base station structure diagram and output the heat dissipation optimization plan within 48 hours (including ANSYS report)
✅Full process support:
Precision stamping: Minimum punching diameter 0.6mm (meet the needs of 5G high-frequency filters)
Special coating: Triple-proof (anti-salt spray/anti-ultraviolet/anti-mold) coating customization
✅Fast delivery:
Standard 6063 T5/T6 aluminum plate inventory (width ≤ 2000mm, support laser cutting)
72-hour delivery, support VMI joint inventory management
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